What Is BGA Rework?

A BGA (Ball Grid Array) is a package whose connections are solder balls under the component. Since the joints are not visible, rework requires a controlled thermal profile and specialized equipment.

Core process

1. 1
   Preheat

   The board is preheated from below to prevent thermal shock and warpage.

2. 2
   Removal

   A profile is applied with a hot-air station; the component is lifted with vacuum.

3. 3
   Reball / cleaning

   Pads are cleaned; the component is reballed.

4. 4
   Placement and verification

   After precise alignment it is soldered; joints are verified by X-Ray.